BALL GRID ARRAY PACKAGE

PURPOSE: A ball grid array package is provided to improve the reliability of the ball grid array package by preventing the formation of the chip crack. CONSTITUTION: A ball grid array package comprises a printed circuit board(20) formed with a substrate pad(23). Junction pads(27) are arranged on the...

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Bibliographic Details
Main Author LEE, GYU JIN
Format Patent
LanguageEnglish
Korean
Published 15.01.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A ball grid array package is provided to improve the reliability of the ball grid array package by preventing the formation of the chip crack. CONSTITUTION: A ball grid array package comprises a printed circuit board(20) formed with a substrate pad(23). Junction pads(27) are arranged on the printed circuit board(20) in a matrix form. A wiring pattern(25) for electrically connecting the junction pads(27) is formed on the printed circuit board(20). A plurality of electrode pads(12) are formed on an active portion. The electrode pads(12) and the substrate pad(23) are bonded by an adhesive. An external connecting terminal is connected to the junction pads(27). The bonding portion is sealed with a molding resin(50). A metal plate(40) having a ring shape is attached to one side of the printed circuit board(20).
Bibliography:Application Number: KR19990021984