PRODUCTION METHOD OF COPPER THIN FILM CORD FOR TIRE

• Main Authors: SU, KON, JO, PYEONG RAE, JEON, KYEONG SU
• Format: Patent
• Language: English
• Published: 15.11.2000
• Edition: 7
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE: A production method of a copper thin film cord is provided to save production time by rapidly forming an adhesive layer, to promote stability and to delay adhesive deterioration. CONSTITUTION: In producing a copper thin film cord, zinc or tin is plated on a wire surface. After the wire surface is drawn in a wire strand, the wire surface is metathesis-plated with a copper salt solution. Herein, the thickness of the copper plating is 20 to 90mm. The metathesis plating is performed by using the copper salt solution selected from a group consisted of copper sulfate, copper chloride, nitric acid copper and ascetic acid copper.