PRODUCTION METHOD OF COPPER THIN FILM CORD FOR TIRE
PURPOSE: A production method of a copper thin film cord is provided to save production time by rapidly forming an adhesive layer, to promote stability and to delay adhesive deterioration. CONSTITUTION: In producing a copper thin film cord, zinc or tin is plated on a wire surface. After the wire surf...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
15.11.2000
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A production method of a copper thin film cord is provided to save production time by rapidly forming an adhesive layer, to promote stability and to delay adhesive deterioration. CONSTITUTION: In producing a copper thin film cord, zinc or tin is plated on a wire surface. After the wire surface is drawn in a wire strand, the wire surface is metathesis-plated with a copper salt solution. Herein, the thickness of the copper plating is 20 to 90mm. The metathesis plating is performed by using the copper salt solution selected from a group consisted of copper sulfate, copper chloride, nitric acid copper and ascetic acid copper. |
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Bibliography: | Application Number: KR19990011832 |