Electroless gold plating solution and process

• Main Authors: OTA YASUO, TOBEN MICHAEL P, MARTIN JAMES L, DAKIJAWA YASUSI, ENOMOTO HARUKI
• Format: Patent
• Language: English; Korean
• Published: 25.08.2000
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE: A non-electrolytic plating composition which is useful for plating a nickel-containing electric circuit plate with gold and a method for plating with a gold layer a nickel-containing electric circuit plate are provided. CONSTITUTION: A aqueous electrolytic gold plating composition comprises at least one aqueous gold compound, at least on organic conductive salt, at least one reducing agent and water. To plate a nickel-containing electric circuit plate with a gold layer, the nickel-containing electric circuit plate is contacted with a gold-immersed plating solution containing the electrolytic gold plating composition. To prepare a printing circuit plate, (i) prepare a circuit plate having a circuit pattern comprising at least one selected from a copper trace, hole and land; (ii) optionally covering a soldermask on an area of the circuit pattern; (iii) contacting the circuit plate with a non-electrolytic nickel plating solution for an enough time to obtain the non-electrolytic nickel plated circuit plate comprising a nickel layer having a thickness of 0.5-10 micron; and (iv) contacting the non-electrolytic nickel plated circuit plate with gold immersed plating solution for enough time to provide gold finish having enough thickness to protect the nickel layer from oxidation. 니켈 함유 기판상에 금 코팅을 형성하는데 유용한 전해질 조성물이 개시된다. 또한 니켈 함유 기판상에 금층을 도금하는 방법이 개시된다.