PROCESS FOR THE ELECTROLYTIC DEPOSITION OF COPPER LAYERS

PURPOSE: Provided is a method for the electrolytic deposition of copper layers on the printed circuit in short time with uniform thickness. CONSTITUTION: A process for the electrolytic deposition of copper layers, in particular on printed circuit boards, has the following steps: an electroconductive...

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Bibliographic Details
Main Authors DAHMS WOLFGANG, SENGE GERD
Format Patent
LanguageEnglish
Published 25.08.2000
Edition7
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PURPOSE: Provided is a method for the electrolytic deposition of copper layers on the printed circuit in short time with uniform thickness. CONSTITUTION: A process for the electrolytic deposition of copper layers, in particular on printed circuit boards, has the following steps: an electroconductive substrate and anodes which are dissolved during electrolytic deposition are brought into contact with a deposition bath which contains copper ions, compounds which increase the electroconductivity of the deposition bath, additives for influencing the material properties of the copper layers, additional compounds of an electrochemically reversible redox system, and additives or mixtures of additives. The substrate and the anodes are connected to a current supply and the copper layers are deposited on the substrate by a pulsed current or pulsed voltage process. This process allows metallic layers with good optical and mechanical properties to be deposited even after only a short stay in the bath.
Bibliography:Application Number: KR19997004258