CENTER ALIGNING DEVICE FOR WAFER AND METHOD THEREFOR

PURPOSE: A device for aligning a center of a wafer and a method for aligning the center of the wafer are provided to align the wafer mounted on a spindle chuck with low cost by reducing the number of cameras which are used to detect the center position of the wafer. CONSTITUTION: A center aligning o...

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Bibliographic Details
Main Author JEONG, MU GIL
Format Patent
LanguageEnglish
Published 15.07.2000
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A device for aligning a center of a wafer and a method for aligning the center of the wafer are provided to align the wafer mounted on a spindle chuck with low cost by reducing the number of cameras which are used to detect the center position of the wafer. CONSTITUTION: A center aligning of a wafer(2) is carried out by a driving device(100) in response to an analog signal of a wafer image. A host module(200) controls the center aligning process and a driving device control module(300) controls the operation of the driving device(100). An image treating module(400) exchanges the signals with the driving device control module(300) and transforms the analog signal attained by the driving device(100) to a digital image signal thereby detecting the position of the wafer(2) by using the image signal.
Bibliography:Application Number: KR19980061062