CARRIER FRAME FOR TAPE BGA SUBSTRATE AND MANUFACTURE METHOD THEREOF

• Main Authors: KIM, SE YEONG, KIM, SU GI, KIM, SO JUNG, LEE, HO YONG
• Format: Patent
• Language: English
• Published: 05.07.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: A carrier frame for a tape BGA substrate is provided to utilize common semiconductor assembly lines, and to improve yield and productivity. CONSTITUTION: A carrier frame includes a frame body(2) on which a plurality of tape BGA substrates(4) are attached by an adhesive tape(9). The frame body(2) has first windows(8) regularly formed therein and side rails(5) formed at both ends thereof. Each of the first windows(8) corresponds to both a second window(9b) in the adhesive tape(9) and a circuit part(A) of the tape BGA substrates(4). While the side rails(5) of the frame body(2) are fitted to transfer rails of common assembly lines, a common feeder can carry the carrier frame by through holes(6,7) in the frame body(2). The frame body(2), the adhesive tape(9) and the substrates(4) are all exactly aligned by respective index holes(7a,9a,4a).