CONTROL EQUIPMENT AND CONTROL METHOD OF WAFER PROCESSING APPARATUS

PURPOSE: The control equipment and the control method of a wafer processing apparatus is provided so that it can jet a wafer processing substance at the same time among the nozzles which jet the wafer processing substance, and that it can prohibit effectively to be coagulated the wafer processing su...

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Bibliographic Details
Main Author KIM, JIN GI
Format Patent
LanguageEnglish
Published 26.06.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:PURPOSE: The control equipment and the control method of a wafer processing apparatus is provided so that it can jet a wafer processing substance at the same time among the nozzles which jet the wafer processing substance, and that it can prohibit effectively to be coagulated the wafer processing substance in the nozzles. CONSTITUTION: The control equipment of a wafer processing apparatus consists of the following sections according to function; the nozzle grouping section forming the data of a nozzle group by grouping the nozzle units by at least two groups in accordance with a fixed goal of a wafer processing operation; the forming section of the jet data forming the jet operation data of the above nozzle units at the base of the above data from nozzle group and the above data from the jet operation; and the performance section of the jet operation to carry out individually the jet of the wafer processing substance in every nozzle units among the above nozzle groups at the base of the data from the above jet operation.
Bibliography:Application Number: KR19980051898