SEMICONDUCTOR DEVICE AND PRODUCING METHOD THEREOF

• Main Authors: HORIUCHI MICHIO, IMAI KAZUNARI
• Format: Patent
• Language: English
• Published: 25.05.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PURPOSE: A semiconductor device of small size such a chip size package and a producing method thereof are provided to reduce producing cost while increasing the number of pins. CONSTITUTION: A connecting surface of a semiconductor chip(10) connected to an intermediate substrate(12) is functioning as an equipping surface of electrode terminal containing an electrode terminal(16). And a connecting land(20) electrically connected to the electrode terminal is formed on a passivation film(18) of the equipping surface of electrode terminal in the semiconductor chip. Also, a connecting bump(14) stored in the intermediate substrate is connected with the connecting land. Also, a via(32) formed on the intermediate substrate is formed more finely than the via filled with conductive paste for reducing the diameter of a connecting pad(22) of the intermediate substrate connected with the connecting land of the semiconductor chip through the connecting bump. Therefore, the size of the semiconductor chip is reduced, and the connecting land with reduced diameter is highly accumulated for the semiconductor chip to be stored in the intermediate substrate.