WAFER CLEANING APPARATUS IN MANUFACTURING OF SEMICONDUCTOR

PURPOSE: A wafer cleaning apparatus is provided to prevent particle or failure of process by disconnected to between the carrier slot and the wafer edge for cleaning of chemicals in the wafer edge. CONSTITUTION: The wafer cleaning apparatus comprises a sub-bar (34) for the pushing of a wafer (33) an...

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Bibliographic Details
Main Author PARK, BYUNG-HEON
Format Patent
LanguageEnglish
Korean
Published 15.03.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A wafer cleaning apparatus is provided to prevent particle or failure of process by disconnected to between the carrier slot and the wafer edge for cleaning of chemicals in the wafer edge. CONSTITUTION: The wafer cleaning apparatus comprises a sub-bar (34) for the pushing of a wafer (33) and formed at center of a guide (32) located on a teflon plate (30). Thus, the shifting of the wafer (33), the edge portion of the wafer (33) and a slot portion of a carrier (31) are non-contact each other. Thereby it is possible to prevent a failure of process and particle. The sub-bar (34) is composed of teflon material. 본 발명은 테브론 플레이터 위면에 보조바를 설치하여 웨이퍼의 위치가 변경되도록 하는 반도체 제조설비의 웨이퍼 세정장치에 관한 것이다. 이는 테브론 플레이터 중간에 보조바를 설치하여 웨이퍼를 약간들어 올림으로써, 웨이퍼 모서리 부분과 캐리어 슬롯 부분이 닿지않도록 하여 웨이퍼 모서리부분에 묻은 케미컬을 세정하여 파티클 또는 공정불량을 방지하는 효과가 있다.
Bibliography:Application Number: KR19980035695