SEMICONDUCTOR PACKAGE

PURPOSE: A semiconductor package is made to solve the structural problem of weakening bonding force between a loading plate(10) and a mold compound(60). CONSTITUTION: A package is made to fasten the outer emission of the heat generated in a semiconductor chip(50) through a heat sink(100) exposed to...

Full description

Saved in:
Bibliographic Details
Main Author SON, SUN JIN
Format Patent
LanguageEnglish
Korean
Published 15.01.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Be the first to leave a comment!
You must be logged in first