SEMICONDUCTOR PACKAGE
PURPOSE: A semiconductor package is made to solve the structural problem of weakening bonding force between a loading plate(10) and a mold compound(60). CONSTITUTION: A package is made to fasten the outer emission of the heat generated in a semiconductor chip(50) through a heat sink(100) exposed to...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
15.01.2000
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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