By-pass type trapping device for byproduct of semiconductor manufacturing

• Main Authors: KIM YONG YUN, CHA IL SU
• Format: Patent
• Language: English; Korean
• Published: 07.06.2024
• Subjects: ACTUATING-FLOATS; BASIC ELECTRIC ELEMENTS; BLASTING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COCKS; DEVICES FOR VENTING OR AERATING; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEATING; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LIGHTING; MECHANICAL ENGINEERING; METALLURGY; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; SEMICONDUCTOR DEVICES; SEPARATION; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TAPS; THERMAL INSULATION IN GENERAL; TRANSPORTING; VALVES; WEAPONS

본 발명은 바이패스형 반도체 제조 부산물 포집장치에 관한 것으로서, 프로세스 챔버와 진공 펌프 사이에서 반도체 제조 부산물을 포집하는 장치에 있어서, 반도체 제조 부산물을 포집하는 메인 포집부; 3 방향으로 갈라진 밸브로서, 제1 방향 단부가 프로세스 챔버에 연결되고, 제2 방향 단부가 상기 메인 포집부의 유입구에 탈착 가능하게 연결되는 상부 3-방향 밸브; 3 방향으로 갈라진 밸브로서, 제1 방향 단부가 진공 펌프에 연결되고, 제2 방향 단부가 상기 메인 포집부의 배출구에 탈착 가능하게 연결되는 하부 밸브; 및 반도체 제조 부산물을 포집하는 것으로서, 일단이 상기 상부 3-방향 밸브의 제3 방향 단부에 연결되고, 타단이 상기 하부 밸브의 제3 방향 단부에 연결되는 바이패스 포집부;를 포함하는 것을 특징으로 한다. The present invention relates to a bypass-type apparatus for collecting semiconductor manufacturing byproducts. The apparatus for collecting semiconductor manufacturing byproducts between a process chamber and a vacuum pump comprises: a main collection unit for collecting semiconductor manufacturing byproducts; an upper three-way valve, which branches in three directions, has a first-direction end portion connected to the process chamber, and has a second-direction end portion detachably connected to an inlet of the main collection unit; a lower valve, which branches in three directions, has a first-direction end portion connected to the vacuum pump, and has a second-direction end portion detachably connected to an outlet of the main collection unit; and a bypass collection unit, which collects semiconductor manufacturing byproducts, has one end connected to a third-direction end portion of the upper three-way valve, and has the other end connected to a third-direction end portion of the lower valve.