ECO-FRIENDLY POLISHING PAD AND MANUFACTURING METHOD THEREOF

• Main Authors: JI MIN GYEONG, YUN JONG WOOK, SEO JANG WON
• Format: Patent
• Language: English; Korean
• Published: 07.06.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

바이오 기반 폴리머 폴리올을 포함하는 폴리우레탄 수지로 제조된 연마패드는 친환경성이 우수하면서 CMP 공정에서 요구되는 경도 및 모듈러스를 가지므로, 반도체 기판의 제조에 이용되어 우수한 성능을 발휘할 수 있다.