DIELECTRIC EPOXY MATERIAL FOR PAVING AND PAVING METHOD USING THE SAME
The purpose of the present invention is to provide an antibacterial insulating epoxy flooring material, which has very excellent electrical insulation properties and has excellent antibacterial properties, and a flooring method using the same. For the antibacterial insulating epoxy flooring material...
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Main Authors | , , , , |
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Format | Patent |
Language | English Korean |
Published |
11.08.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The purpose of the present invention is to provide an antibacterial insulating epoxy flooring material, which has very excellent electrical insulation properties and has excellent antibacterial properties, and a flooring method using the same. For the antibacterial insulating epoxy flooring material as a two-liquid-type eco-friendly coating agent including a main agent and a curing agent, a first main agent (11) is prepared by mixing 20 to 60 parts by weight of a first epoxy resin having an epoxy equivalent weight (EEW) of 187 to 205 [g/eq], 1 to 6 parts by weight of a reactive diluent for viscosity control having an EEW of 275 to 300, 2 to 20 parts by weight of a non-reactive diluent, 6 to 50 parts by weight of a filler, and 0.5 to 10 parts by weight of an antibacterial agent as an additive, a first curing agent (12) is prepared by mixing 1 to 10 parts by weight of a curing agent resin having an active hydrogen equivalent weight (A.H.E.W) of 350 to 400 [g/eq], 2 to 20 parts by weight of a non-reactive diluent, 5 to 15 parts by weight of an amine curing agent having an A.H.E.W of 110 [g/eq], and 0.1 to 2 parts by weight of an antibacterial agent as an additive, and the main agent and the curing agent are mixed at a weight ratio of 4 to 6:1.
본 발명의 목적은, 전기절연성이 매우 우수하고 우수한 항균 기능을 갖는 항균 절연 에폭시 바닥제 및 이를 이용한 바닥 시공방법을 제공하기 위한 것으로, 본 발명의 항균 절연 에폭시 바닥제는, 주제와 경화제로 이루어지는 2액형 친환경 코팅제로서, 에폭시 수지 당량(EEW)이 187 ~ 205 [g/eq]인 제1 에폭시 수지 20 ~ 60 중량부와, 에폭시 수지 당량(EEW)이 275 ~ 300 인 점도조절용 반응성 희석제 1 ~ 6 중량부와, 비반응성 희석제 2 ~ 20 중량부와, 충전제(filler) 6 ~ 50 중량부와, 첨가제로서 항균제 0.5 ~ 10 중량부를 혼합하여 제1 주제(11)를 배합하고, 활성 수소 당량(A.H.E.W)이 350 ~ 400 [g/eq]인 경화제 수지 1 ~ 10 중량부; 비반응성 희석제 2 ~ 20 중량부; 활성 수소 당량(A.H.E.W)이 110 [g/eq]인 아민 경화제 5 ~ 15 중량부; 및 첨가제로서 항균제 0.1 ~ 2 중량부; 를 혼합하여 제1 경화제(12)를 배합하며, 상기 주제와 경화제를 4 ~ 6 : 1 의 무게비로 혼합하여 이루어지는 것을 특징으로 한다. |
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Bibliography: | Application Number: KR20230092208 |