retainer ring for chemical polishing device head wafer polishing head with the same

• Main Author: BOO, JAE PHIL
• Format: Patent
• Language: English; Korean
• Published: 26.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

The present invention provides a retaining ring for a chemical polishing device head that accommodates and polishes a wafer in an internal hollow portion, the retainer ring comprising a ring-shaped first member (110) and a second member (120) provided in the vertical direction inside the first member and made of a more wear-resistant material than the first member, so that the second member of the wear-resistant material provided inside the retaining ring is not worn even while a wafer polishing operation is in progress, thereby maintaining a constant distance between a wafer and a polishing pad even during wafer polishing. 본 발명은 내부 중공부에서 웨이퍼를 수용하여 연마하는 화학연마장치 헤드용 리테이너링으로서, 링 형상의 제1부재(110);과 상기 제1부재의 내부에서 상하방향으로 구비되고, 상기 제1부재 보다 내마모성 재질로 이루어지는 제2부재(120);를 포함하는 리테이너링을 제공하여, 웨이퍼 연마 작업이 진행되는 중에도 리테이너링 내부에 구비되는 내마모성 재질의 제2부재는 마모되지 않도록 함으로써 웨이퍼 연마 도중에도 웨이퍼와 연마 패드 사이의 간격을 일정하게 유지하게 되는 것이 특징이다.