All-in-one insulation heating jacket system that heats vacuum piping of semiconductor equipment

The present invention relates to an all-in-one insulation heating jacket system for heating a vacuum pipe of a semiconductor equipment, which is installed on the vacuum pipe of the semiconductor equipment and heats the vacuum pipe to a certain temperature. The present invention is able to, during a...

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Bibliographic Details
Main Author HAN DONGWOO
Format Patent
LanguageEnglish
Korean
Published 07.11.2022
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Summary:The present invention relates to an all-in-one insulation heating jacket system for heating a vacuum pipe of a semiconductor equipment, which is installed on the vacuum pipe of the semiconductor equipment and heats the vacuum pipe to a certain temperature. The present invention is able to, during a high-temperature gas process of a semiconductor equipment and a process of the chemical vapor deposition (CVD) method, heat a vacuum pipe, where the reaction gas including AIO_3, CI_3, and BCI_2 is moved, within a vacuum insulation segment, improve the connection unit finish structure of a vacuum insulator sheet forming the vacuum insulation segment, and greatly save heating energy in a compact structure. The all-in-one insulation heating jacket system for heating the vacuum pipe of the semiconductor equipment comprises: a heat wire sheet (10); an insulation sheet (20); and an outer cover sheet (30). 본 발명은 반도체 설비의 진공배관에 설치되어, 진공배관을 소정의 온도로 가열하는 반도체 설비의 진공배관을 히팅하는 일체형 단열 히팅 자켓시스템에 있어서, 반도체 설비의 고온 GAS 공정 및 CVD(화학기상 증착)방식의 공정 작업 시, AIO3, CI2, BCI2을 포함하는 반응가스가 이동되는 진공배관을 진공단열구획 내에서 히팅함과 더불어 진공단열구획을 형성하는 진공단열재시트의 연결부 마감구조를 개선하여 콤팩트한 구조에서 히팅 에너지를 크게 절감할 수 있도록 열선시트(10), 단열시트(20), 외피시트(30)를 포함하여 주요구성으로 한다.
Bibliography:Application Number: KR20220027232