Non-reciprocal Circuit Element with a central conductor assembly of a stacked structure

Disclosed is a non-reciprocal circuit element comprising: an upper-side laminated part; a lower-side laminated part; and a central conductor assembly disposed between the upper-side laminated part and the lower-side laminated part, wherein the central conductor assembly comprises a first ground laye...

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Bibliographic Details
Main Authors BAN YONG JU, LEE DONG HWI, GOH HEE SUK, KIM IN GYU
Format Patent
LanguageEnglish
Korean
Published 26.09.2022
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Summary:Disclosed is a non-reciprocal circuit element comprising: an upper-side laminated part; a lower-side laminated part; and a central conductor assembly disposed between the upper-side laminated part and the lower-side laminated part, wherein the central conductor assembly comprises a first ground layer and a central conductor disposed on the first ground layer and insulated from the first ground layer, and a capacitance is formed between the first ground layer and the central conductor. Therefore, the present invention is capable of reducing a physical size of the non-reciprocal circuit element. 상측 적층부, 하측 적층부, 및 상기 상측 적층부와 상기 하측 적층부 사이에 배치된 중심도체 어셈블리를 포함하며, 상기 중심도체 어셈블리는, 제1접지층, 및 상기 제1접지층 상에 배치되어 있으며 상기 제1접지층과 절연되어 있는 중심도체를 포함하며, 상기 제1접지층과 상기 중심도체 간에는 커패시턴스가 형성되어 있는, 비가역 회로소자를 공개한다.
Bibliography:Application Number: KR20210153243