LEVELER AND ELECTROPLATING SOLUTION FOR BUMP

The present invention relates to a leveling agent for controlling a plating mechanism to have a uniform height even when a high current as well as a low current is applied during a plating process for forming a bump, and an electroplating solution for forming the bump comprising the same. The electr...

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Bibliographic Details
Main Authors NAKEUN KO, KIM DEA GEUN, CHUNG BO MOOK, SIM JUYONG, CHUN, SUNG WOOK
Format Patent
LanguageEnglish
Korean
Published 10.03.2022
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a leveling agent for controlling a plating mechanism to have a uniform height even when a high current as well as a low current is applied during a plating process for forming a bump, and an electroplating solution for forming the bump comprising the same. The electroplating solution for forming the bump provided in the present invention comprises: a metal ion source; and the leveling agent. 본 발명은 범프를 형성하는 도금 과정에서 저전류뿐만 아니라 고전류가 인가되더라도 균일한 높이를 갖도록 도금 메커니즘을 제어하는 레벨링제; 및 이를 포함하는 범프 형성용 전기 도금액에 관한 것이다.
Bibliography:Application Number: KR20210118202