Method for manufacturing printed circuit board using atmosphere pressure plasma

• Main Author: PARK, HYUN BAE
• Format: Patent
• Language: English; Korean
• Published: 09.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention relates to a printed circuit board manufacturing method. According to the present invention, a printed circuit board is surface-treated using atmosphere pressure plasma before a coverlay is temporarily joined. As a result, a surface contaminant can be effectively removed. In ad...