Method for manufacturing printed circuit board using atmosphere pressure plasma

• Main Author: PARK, HYUN BAE
• Format: Patent
• Language: English; Korean
• Published: 09.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention relates to a printed circuit board manufacturing method. According to the present invention, a printed circuit board is surface-treated using atmosphere pressure plasma before a coverlay is temporarily joined. As a result, a surface contaminant can be effectively removed. In addition, coverlay flow can be prevented by an increase in bonding force, and thus the occurrence of an electrical failure can be reduced and preference can be enhanced. The manufacturing method includes: (a) a step of preparing a printed circuit board having a circuit pattern with a preset shape; (b) a step of surface-treating the printed circuit board using atmosphere pressure plasma; (c) a step of placing a coverlay film on the printed circuit board and performing temporary joining after the surface treatment in the (b) step; and (d) a step of performing thermocompression bonding on the printed circuit board after the temporary coverlay film joining to cause close contact and stacking of the coverlay film on the printed circuit board. 본 발명은 커버레이를 가접시키기 전 단계에 인쇄회로기판을 대기압 플라즈마를 이용해 표면처리하여 표면의 오염물질을 효과적으로 제거하고, 접합력 증가에 의해 커버레이의 유동을 방지할 수 있어 전기적 불량 발생이 저감되어 기호도가 높은 인쇄회로기판의 제조방법에 관한 것이다. 본 발명에 따른 인쇄회로기판의 제조방법은 (a) 미리 설정된 형상의 회로패턴이 형성된 인쇄회로기판을 준비하는 단계; (b) 대기압 플라즈마를 이용해 상기 인쇄회로기판을 표면 처리하는 단계; (c) 상기 단계(b)에서, 표면 처리한 인쇄회로기판에 커버레이 필름을 적재한 다음 가접시키는 단계; 및 (d) 상기 커버레이 필름이 가접된 인쇄회로기판을 열압착시켜 상기 커버레이 필름을 상기 인쇄회로기판 상에 밀착시켜 적층하는 단계를 포함한다.