Coating System for Semiconductor Package Electromagnetic Interference Shielding Layer

The present invention relates to a coating system of an electromagnetic shield layer of a semiconductor package, which forms a uniform electromagnetic shield layer without a piled part on a semiconductor package and forms an electromagnetic shield layer on the top surface and the side surfaces in al...

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Bibliographic Details
Main Author JANG JAE SHIN
Format Patent
LanguageEnglish
Korean
Published 09.09.2021
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Summary:The present invention relates to a coating system of an electromagnetic shield layer of a semiconductor package, which forms a uniform electromagnetic shield layer without a piled part on a semiconductor package and forms an electromagnetic shield layer on the top surface and the side surfaces in all directions. The coating system blocks a piled part of shield material, which is dropped out as an ion form from centers of a plurality of cathode guns that are obliquely arranged while facing to each other, using a blocking element of a coating uniformity control element, so that uniformly forms the top surface and the side surfaces in all directions without the piled part when forming an electromagnetic shield layer on a semiconductor package. The present invention comprises a vacuum chamber, a base body, a tray assembly body, a plurality of cathode guns, and a coating uniformity control element. 본 발명은 반도체 패키지에 중첩 부분 없이 균일한 전자파 차폐층을 형성할 수 있으며, 상면과 함께 전후좌우 측면에도 전자파 차폐층을 형성할 수 있는 반도체 패키지 전자파 차폐층 코팅 시스템에 관한 것으로, 복수가 서로 대칭되게 마주보며, 경사지게 배치된 캐소드건의 중앙에서 이온 형태로 탈락되는 차폐 소재의 중첩 부분을 코팅 균일도 조절구의 차단구로 막아주어 반도체 패키지에 전자파 차폐층 형성 시 중첩되는 부분 없이 균일하게 상면과 함께 전후좌우 측면에 형성할 수 있는 효과가 있다.
Bibliography:Application Number: KR20210096385