Adhesive sheet and coverlay film including an adhesive layer and flexible printed circuits board including the adhesive sheet

• Main Authors: LEE JEONG WOO, JANG YUN JUNG, LEE HA SOO, EOM SANG YEOL
• Format: Patent
• Language: English; Korean
• Published: 25.02.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

폴리이미드 수지를 주성분으로 하여 비스말레이미드 수지, 에폭시 수지, 활성 에스테르 수지, 및 무기 입자를 포함하는 접착제층을 포함하고, 상기 접착제층은 IR 스펙트럼의 1730~1750 cm-1 파수에서 흡수피크가 나타나는 접착시트 및 커버레이 필름, 및 상기 접착시트를 포함하는 연성인쇄회로기판이 개시된다.