MANUFACTURING METHOD FOR CIRCUIT USING POLYIMIDE FILM

A manufacturing method of a circuit board of the present invention includes a step of forming an insulating layer on the circuit board being manufactured, wherein the step of forming the insulating layer is formed by bonding a polyimide film on the circuit board being manufactured using a thermocomp...

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Bibliographic Details
Main Authors YOUN SANG WOOK, KIM SUNG JUN, KIM YOUNG JUN, PARK DOO HWAN, SEO HAN EOL, KIM CHUNG HYEON
Format Patent
LanguageEnglish
Korean
Published 10.08.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A manufacturing method of a circuit board of the present invention includes a step of forming an insulating layer on the circuit board being manufactured, wherein the step of forming the insulating layer is formed by bonding a polyimide film on the circuit board being manufactured using a thermocompression bonding method, thereby enabling management of the flatness of the circuit board. 본 발명의 회로 기판의 제조 방법은, 제조 중인 회로 기판의 상부에 절연층을 형성하는 단계;를 포함하되, 상기 절연층을 형성하는 단계는, 제조 중인 회로 기판의 상부에 폴리이미드 필름을 열압착 방식으로 접합하는 것에 의해 형성되는 것을 특징으로 한다.
Bibliography:Application Number: KR20190021710