Capillary For Wire Bonding And Method Of Fabricating The Same

The present invention provides a capillary for wire bonding which comprises: a body part having a cylindrical shape; a first tapered part connected to the body part and having a reverse tapered shape; and a second tapered part connected to the first tapered part and having a tapered shape. According...

Full description

Saved in:
Bibliographic Details
Main Authors LIM HYOUNG JU, LEE, HYANG EE, SHIN HYUN WOONG, KIM YOUNG JIN, HWANG SUNG WOOK
Format Patent
LanguageEnglish
Korean
Published 15.05.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The present invention provides a capillary for wire bonding which comprises: a body part having a cylindrical shape; a first tapered part connected to the body part and having a reverse tapered shape; and a second tapered part connected to the first tapered part and having a tapered shape. According to the present invention, transfer force of ultrasound wave energy is increased and life can be extended. 본 발명은, 원기둥 형상을 갖는 몸체부와; 상기 몸체부에 연결되고, 역테이퍼 형상을 갖는 제1테이퍼부와; 상기 제1테이퍼부에 연결되고, 테이퍼 형상을 갖는 제2테이퍼부를 포함하는 와이어 본딩용 캐필러리를 제공한다.
Bibliography:Application Number: KR20190108114