RESIN COMPOSITION METAL LAMINATE AND PRINTED CIRCUIT BOARD USING THE SAME AND METHOD FOR MANUFACTURING THE METAL LAMINATE

• Main Authors: CHO KYEONGWOON, KIM HYUNGKYU, LEE JINSOO
• Format: Patent
• Language: English; Korean
• Published: 06.04.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention relates to a resin composition, a metal laminate and a printed circuit board using the same, and a method for manufacturing the metal laminate. The resin composition includes at least one elastomer selected from the group consisting of fluorine-based elastomers and styrene-based elastomers; fluorine resin fillers; and inorganic fillers. The resin composition of the present invention is excellent in heat resistance and workability. 본 발명은 수지 조성물, 이를 이용한 금속 적층체와 인쇄회로기판 및 상기 금속 적층체의 제조방법에 대한 것으로, 상기 수지 조성물은 불소계 엘라스토머 및 스티렌계 엘라스토머로 이루어진 군에서 선택된 1종 이상의 엘라스토머; 불소 수지 필러; 및 무기 필러를 포함한다.