3 3 DIMENSIONAL SHAPE DETECTION APPARATUS AND METHOD
According to the present invention, a position of a circuit component, which is a region of interest in a low-resolution pattern, is identified, the region of interest can be moved by an optical and a mechanical method for precise measurement, and an optimal high-resolution pattern for each region o...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
14.10.2019
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Subjects | |
Online Access | Get full text |
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Summary: | According to the present invention, a position of a circuit component, which is a region of interest in a low-resolution pattern, is identified, the region of interest can be moved by an optical and a mechanical method for precise measurement, and an optimal high-resolution pattern for each region of interest can be selected and measured, thereby increasing a processing speed and making a precise depth measurement.
본 발명은 저해상도 패턴으로 관심 영역인 회로 부품의 위치를 확인하고 정밀한 측정을 위해 관심 영역을 광학적, 기계적 방법으로 이동시키고 관심 영역별 최적 고해상도 패턴을 선정하여 측정할 수 있어 처리 속도를 높이고 정밀한 깊이 측정을 할 수 있다. |
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Bibliography: | Application Number: KR20180037058 |