MANUFACTURING METHOD OF FLEXIBLE TRANSPARENT COPPER FILMS HAVING ULTRA-HIGH CONDUCTIVITY AND THE COPPER FILMS MADE THEREFROM

• Main Authors: KIM, HAE SUNG, NO SEONG RAE, SEOL YOON HEE, KIM KYU BYUNG, SHIN JEE HOON, SOH, SOON YOUNG, SHIN YONG WOO
• Format: Patent
• Language: English; Korean
• Published: 12.08.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CONDUCTORS; ELECTRICITY; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES

The present invention relates to a manufacturing method of an ultra-high conductivity flexible transparent copper film, and to a copper film manufactured therefrom. In the manufacturing method, ink in which nano-silver particles are dispersed is coated on a desired base material film to form a silver pattern. And, by performing clear resin coating on the silver pattern, coating only a protruding upper layer portion of the silver pattern to be exposed to the outside, and then electroplating copper onto the silver pattern, a transparent thin film is performed while fiberization of pure copper is made around the upper layer portion of the exposed silver pattern, and the formed transparent thin film is separated from the silver pattern. 본 발명은 나노 실버 입자가 분산된 잉크(Ink)를 원하는 기재필름에 코팅하여 실버 패턴(Silver Pattern)을 형성하고, 상기 실버 패턴(Silver Pattern) 위로 클리어 레진 코팅(Clear resin coating)하되, 상기 실버 패턴(Silver Pattern)의 돌출된 상층부만 외부에 노출되도록 코팅한 후, 상기 실버 패턴(Silver Pattern) 위로 구리(Copper) 전기도금함으로써, 상기 노출된 실버 패턴(Silver Pattern)의 상층부를 중심으로 순수 구리(Copper)의 섬유화가 이루어지면서 투명 박막 필름이 형성되고, 이와 같이 형성된 투명 박막 필름을 실버 패턴(Silver Pattern)으로부터 분리함으로써 완성되는 초고전도 플랙서블 투명 구리 필름 제조방법 및 이로부터 제조된 구리 필름에 관한 것이다.