Metal foil hole processing method using electrolytic processing

• Main Authors: CHOI SEUNG GEON, CUI XIONGJIE, PARK TAE WON, KIM SEONG HYUN, LEE EUN SANG, MOON GI CHANG, SONG WOO JAE
• Format: Patent
• Language: English; Korean
• Published: 25.04.2019
• Subjects: MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL; TRANSPORTING; WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL

Provided is a method for processing a hole on a metal thin plate using an electrolytic processing, wherein a dimple is formed corresponding to a hole processing position on the surface of a metal thin plate, before a PDMS-masking is formed at the dimple. An exposed portion on the metal thin plate at which the PDMS-masking is not formed undergoes a passivation processing. After the PDMS-masking is removed from the dimple, a hole is formed at the dimple through an electrolytic processing. Therefore, an undercut phenomenon is significantly reduced, such that a hole size and the undercut of the entire processed area can be uniformly controlled. Moreover, a hole processing of the entire processed area is uniformly performed, thereby preventing processing precision from deteriorating. 본 발명은 금속 박판의 표면 중 홀 가공위치에 대응하여 딤플을 형성하고, 상기 딤플에 피디엠에스-마스킹(PDMS-Masking)을 형성한 후, 금속 박판 중 피디엠에스-마스킹이 형성되지 않은 노출된 부분은 부동태화 처리를 하며, 상기 딤플에서 피디엠에스-마스킹 제거 후, 전해가공으로 상기 딤플에 홀을 형성하면, 언더컷 현상이 현저하게 감소하여, 가공부위 전체의 홀 사이즈 및 언더컷을 균일하게 제어할 수 있고, 전체 가공영역의 홀가공을 균일하게 진행함으로써 가공 정밀도 저하를 막을 수 있는 전해가공을 이용한 금속 박판 홀 가공방법을 제공한다.