Construction method of building structure using exterior insulation material wall module

• Main Authors: SHIN, SANG HOON, CHOI, MYOUNG SIG, LEE, GANG CHUL, CHO, KYUNG RAE
• Format: Patent
• Language: English; Korean
• Published: 11.12.2018
• Subjects: BUILDING; BUILDING IMPLEMENTS OR OTHER BUILDING AIDS, OR THEIRUSE; CEILINGS; FIXED CONSTRUCTIONS; FLOORS; FORMS; GENERAL BUILDING CONSTRUCTIONS; HANDLING BUILDING MATERIALS ON THE SITE; INSULATION OR OTHER PROTECTION OF BUILDINGS; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTINGBUILDINGS; ROOFS; SCAFFOLDING; SHUTTERING; WALLS, e.g. PARTITIONS

The present invention relates to a wall module integrated with an external insulation material and a construction method of a building structure using the same. The wall module integrated with an external insulation material comprises: a first PC panel disposed on an inner side of the building structure; a second PC panel spaced from the first PC panel by a predetermined distance and disposed on an outer side of the building structure; an external insulation material spaced from the inner surface of the first PC panel to form a separation space with the first PC panel and allowing one surface to be attached to the inner surface of the second PC panel; and a connection member of which one side is embedded in the first PC panel and the other side is embedded in the second PC panel by passing through the external insulation material so as to enable the first PC panel to be connected to the second PC panel. 본 발명은, 외단열재가 일체화된 벽체모듈 및 이를 이용한 건축 구조물의 시공방법에 관한 것으로서, 외단열재가 일체화된 벽체모듈에 있어서, 건축 구조물의 실내측에 배치되는 제1 PC패널; 상기 제1 PC패널로부터 설정 거리 이격되며, 상기 건축 구조물의 실외측에 배치되는 제2 PC패널; 상기 제1 PC패널과의 사이에 이격공간을 형성하도록 상기 제1 PC패널의 내측면과 이격되되, 일면이 상기 제2 PC패널의 내측면에 부착되어 구비되는 외단열재; 및 일측은 상기 제1 PC패널에 매립되고, 타측은 상기 외단열재를 관통하여 상기 제2 PC패널에 매립되어 상기 제1 PC패널과 상기 제2 PC패널을 연결하는 연결부재를 포함한다.