PIG PIG Sand blasting applied PIGphosphor in glass layer and manufacturing method thereof

Disclosed are a sand blasting applied phosphor-in-glass (PIG) layer, and a manufacturing method thereof. The manufacturing method of a PIG layer, in a manufacturing method for a PIG layer used for a vehicle LED chip, comprises: a press step of mixing glass powder and a fluorescent material at a pred...

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Bibliographic Details
Main Author YANG, CHUNG MO
Format Patent
LanguageEnglish
Korean
Published 17.05.2018
Subjects
ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GRINDING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:Disclosed are a sand blasting applied phosphor-in-glass (PIG) layer, and a manufacturing method thereof. The manufacturing method of a PIG layer, in a manufacturing method for a PIG layer used for a vehicle LED chip, comprises: a press step of mixing glass powder and a fluorescent material at a predetermined ratio, and forming a PIG molded body by applying pressure thereto with a press; a heating step of improving strength by applying heat to the PIG molded body molded through the press step; a primary polishing step of increasing the transmittance of light by polishing one side of the PIG molded body to improve surface roughness and secure gloss; an etching step of forming a pattern on the surface of the PIG molded body through etching; an uneven part forming step of forming unevenness on one side surface of the etched PIG molded body; a secondary polishing step of increasing the transmittance of light by polishing the other side surface of the PIG molded body to make the PIG molded body satisfy design dimensions and secure surface gloss; and a cutting step of cutting the PIG molded body into a predetermined size. The present invention increases a specific surface area due to the unevenness formed on the surface, and improves a light output by improving the transmittance of light beams emitted from an LED chip to the outside. 샌드 블래스팅이 적용된 PIG(phosphor in glass)층 및 PIG층의 제조방법이 개시된다. PIG(phosphor in glass)층의 제조방법은 차량용 엘이디 칩(LED chip)에 사용되는 PIG(phosphor in glass)층의 제조방법에 있어서, 유리 분말과 형광물질을 소정의 비율로 혼합한 후 프레스로 압력을 가하여 PIG 성형체를 형성하는 프레스 단계; 상기 프레스 단계를 통해 성형된 PIG 성형체에 열을 가하여 강도를 높이는 히팅 단계; 상기 PIG 성형체 일측면을 연마하여 표면 조도를 높이고 광택이 나도록 하여 빛의 투과율을 높이는 1차 폴리싱 단계; 상기 PIG 성형체 표면 상에 식각을 통해 패턴을 형성하는 식각 단계; 상기 식각된 PIG 성형체의 일측면에 요철을 형성하는 요철 형성 단계; 상기 PIG 성형체의 타측면을 연마하여 PIG 성형체가 설계 치수를 만족 하고 표면 광택이 나도록 하여 빛의 투과율을 높이는 2차 폴리싱 단계; 및 PIG 성형체를 소정의 크기로 절단하는 절단 단계;를 포함하며, 표면 상에 형성된 요철로 인하여 표면적을 증가시키고 엘이디 칩으로부터 발산되는 광선의 외부로의 투과율을 향상시켜 광출력을 높이는 것을 특징으로 한다.
Bibliography:Application Number: KR20170115204