Substrate chucking device and method for chucking using it

• Main Authors: KIM, KWANG RAK, PARK, JONG KWAN, PAHK, HEUI JAE
• Format: Patent
• Language: English; Korean
• Published: 05.03.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SEMICONDUCTOR DEVICES; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

The present invention relates to a substrate chucking device of an upper chucking type and a substrate chucking method using the same, wherein a substrate, used in manufacturing an OLED and the like, is arranged under an adsorption unit. According to the present invention, the substrate chucking device comprises a substrate support unit, a main adsorption unit, a vacuum pad unit, a first driving unit, a second driving unit, and a control unit. According to the present invention, the substrate chucking method comprises a substrate arrangement step, a pre-adsorption step, and an adsorption step. According to the present invention, the substrate is primarily absorbed by a vacuum pad unit and secondarily absorbed by the main adsorption unit to chuck the substrate in a state where the substrate becomes flat. 본 발명은 OLED 등을 제조하는데 사용되는 기판이 흡착부 아래에 배치되는 상부 척킹 방식의 기판 척킹장치 및 이를 이용한 기판 척킹 방법에 관한 것이다. 본 발명의 기판 척킹장치는 기판지지부와, 메인흡착부와, 진공패드부와, 제1구동부와, 제2구동부와, 제어부를 포함하고, 본 발명의 기판 척킹 방법은 기판 배치단계와, 가 흡착단계와, 본 흡착단계를 포함하며, 본 발명은 진공패드부로 기판을 1차 흡착한 후, 메인흡착부로 2차 흡착함으로써, 기판이 반듯하게 펴진 상태로 척킹되는 것을 특징으로 한다.