HEAT-DISSPATING PRINTED CIRCUIT BOARD USING CARBON-BASED MATERIAL AND METHOD FOR FABRICATING THE SAME

The present invention relates to a heat dissipation printed circuit board which comprises: a carbon-based material plate including a carbon-based mixing material, a polymer resin, and a silicate; an insulation layer formed on the carbon-based material plate; and a conductive pattern formed on the in...

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Bibliographic Details
Main Authors MOON, KYU SIK, CHOI, NAM KYU, LEE, SEOK, EOM, CHANG YONG, JANG, JAE MAN
Format Patent
LanguageEnglish
Korean
Published 28.02.2018
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention relates to a heat dissipation printed circuit board which comprises: a carbon-based material plate including a carbon-based mixing material, a polymer resin, and a silicate; an insulation layer formed on the carbon-based material plate; and a conductive pattern formed on the insulation layer. The carbon-based mixing material comprises a carbon material dispersion object and a graphite material. Therefore, the printed circuit board can emit heat to the outside by using a carbon-based mixing material having excellent heat conduction and heat dissipation features. 본 기술은 탄소계 혼합재료, 고분자 수지 및 규산염을 포함하는 탄소계 재료 플레이트; 상기 탄소계 재료 플레이트 상에 형성된 절연층; 및 상기 절연층 상에 형성된 도전 패턴을 포함하고, 상기 탄소계 혼합재료는 탄소재료 분산물 및 흑연재료를 포함하는 방열 인쇄 회로 기판에 관한 것이다.
Bibliography:Application Number: KR20170104630