HEAT-DISSPATING PRINTED CIRCUIT BOARD USING CARBON-BASED MATERIAL AND METHOD FOR FABRICATING THE SAME
The present invention relates to a heat dissipation printed circuit board which comprises: a carbon-based material plate including a carbon-based mixing material, a polymer resin, and a silicate; an insulation layer formed on the carbon-based material plate; and a conductive pattern formed on the in...
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Main Authors | , , , , |
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Format | Patent |
Language | English Korean |
Published |
28.02.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a heat dissipation printed circuit board which comprises: a carbon-based material plate including a carbon-based mixing material, a polymer resin, and a silicate; an insulation layer formed on the carbon-based material plate; and a conductive pattern formed on the insulation layer. The carbon-based mixing material comprises a carbon material dispersion object and a graphite material. Therefore, the printed circuit board can emit heat to the outside by using a carbon-based mixing material having excellent heat conduction and heat dissipation features.
본 기술은 탄소계 혼합재료, 고분자 수지 및 규산염을 포함하는 탄소계 재료 플레이트; 상기 탄소계 재료 플레이트 상에 형성된 절연층; 및 상기 절연층 상에 형성된 도전 패턴을 포함하고, 상기 탄소계 혼합재료는 탄소재료 분산물 및 흑연재료를 포함하는 방열 인쇄 회로 기판에 관한 것이다. |
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Bibliography: | Application Number: KR20170104630 |