PLATING ZIG DEVICE

According to an embodiment of the present invention, a plating jig device comprises: a frame unit, a sensor fixing unit, and a distance adjustment unit. According to an embodiment of the present invention, a distance of sensor fixing units is able to be adjusted by the distance adjustment unit to ea...

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Bibliographic Details
Main Author SHIN, KWANG SIK
Format Patent
LanguageEnglish
Korean
Published 08.12.2017
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:According to an embodiment of the present invention, a plating jig device comprises: a frame unit, a sensor fixing unit, and a distance adjustment unit. According to an embodiment of the present invention, a distance of sensor fixing units is able to be adjusted by the distance adjustment unit to easily insert and fixate a base body to which metal thin plates are connected, and plating mass production of metal thin plates being able to stably be performed by preventing by preventing the base body from being left in the sensor fixing units. 본 발명의 일 실시예에 따른 도금 지그 장치는, 프레임 유닛, 센서 고정 유닛, 그리고 유격 조절 유닛을 주요 구성으로 포함한다. 본 실시예에 따르면 유격 조절 유닛에 의해 센서 고정 유닛들의 거리가 조절 가능하므로 금속 박판들이 연결되어 있는 모체를 끼우고 고정하는 작업이 용이하며, 센서 고정 유닛들에서 모체의 이탈이 방지됨으로써 금속 박판들의 도금 작업 대량으로 안정적으로 진행할 수 있다.
Bibliography:Application Number: KR20170048168