Machining position correction apparatus and method thereof

The present invention relates to a processing position correcting device capable of promoting the improvement of processing accuracy by minimizing error generation difference between positions of an actual processing hole and a designed processing hole by measuring a transformed degree of a PCB mate...

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Bibliographic Details
Main Authors LEE, KYOUNG JUN, KIM, DOH HOON, HUR, JUN GYU
Format Patent
LanguageEnglish
Korean
Published 27.03.2017
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:The present invention relates to a processing position correcting device capable of promoting the improvement of processing accuracy by minimizing error generation difference between positions of an actual processing hole and a designed processing hole by measuring a transformed degree of a PCB material, when processing a hole in the PCB material, and calculating an error correcting formula based on the measured transformed degree of the PCB material, and to a processing position correcting method. The processing position correcting method includes: a step of receiving an input of a design drawing for processing the PCB material and extracting align mark design information from the inputted design drawing; a step of extracting actual coordinate information of an align mark on the PCB material with a photographing device; a step of calculating a position correcting value for correcting the difference between the positions of the actual processing hole and the designed processing hole based on the align mark design information and the actual coordinate information; and a step of correcting processing hole coordinates based on the calculated position correcting value. PCB 자재 홀 가공 시, 자재 변형 정도를 측정하고, 이를 기반으로 오차 보정 식을 산출하여 설계상 가공 홀 위치와 실제 가공 홀 위치 간의 오차 발생 편차를 최소화하여 가공 정밀도 향상을 도모하도록 한 가공 위치 보정장치 및 그 방법에 관한 것으로서, PCB 자재 가공을 위한 설계 도면을 입력받고, 상기 입력받은 설계 도면으로부터 얼라인 마크 설계 정보를 추출하는 단계; 촬영장치를 이용하여 PCB 자재의 얼라인 마크의 실제 좌표 위치정보를 추출하는 단계; 얼라인 마크 설계 정보와 실제 좌표 위치정보를 기초로 자재 변형에 따른 가공 홀 위치를 보상하기 위한 위치 보상 값을 산출하는 단계; 및 산출한 위치 보상 값으로 가공 홀 위치 좌표를 보정하는 단계를 포함하여, PCB 자재의 홀 가공을 위한 가공 위치 보정방법을 구현한다.
Bibliography:Application Number: KR20160075321