PLATING EQUIPMENT FOR SOLAR CELL WAFER USING ELECTROPLATING AND LIGHT-INDUCED PLATING JOINTLY

• Main Authors: KIM, PAN SOO, LEE, DUK HAENG, JUNG, WOON SUK, LIM, JIN GUY
• Format: Patent
• Language: English; Korean
• Published: 10.11.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

The present invention relates to a plating apparatus for a solar cell which performs both electroplating and light induced plating with respect to a side of a wafer to be plated. The plating apparatus (100) of the present invention includes: a substrate mount (130) which is installed above a plating bath, supports corners of the wafer (1), sunken horizontally in the plating bath, along an upper end portion (132), and functions as an outlet to allow the side of the wafer to be sunken in a plating solution; a first plating unit (10) which performs electroplating on the wafer (1) through a positive electrode member (190) installed on a lower portion of the plating bath; a second plating bath (20) which is located in the plating bath between the positive electrode member (190) and the wafer (1), includes a plurality of light sources (122) which transmit light toward the wafer (1), are encapsulated in the plating solution, and are installed in a horizontal matrix, and performs light induced plating; and a solution driving unit (40) which stirs the plating solution and makes the plating solution overflow through an upper discharging hole (133) of the substrate mount (130). 본 발명은 피도금체인 웨이퍼의 단면 침지에 대한 전기도금 및 광유도 도금을 병행하는 태양전지 기판용 도금장치에 관한 것이다. 본 발명의 도금 장치(100)는, 도금조 위에 설치되어 그 상단(132)을 따라 도금조에 수평으로 침지되는 웨이퍼(1)의 모서리들을 지지하며, 도금용액이 웨이퍼의 단면을 침지하는 출구로 기능하는 기판 거치대(130)와, 도금조의 하부에 설치된 양극 부재(190)를 통해서 웨이퍼(1)에 전기도금을 실시하는 제 1 도금부(10)와, 양극부재(190)와 상기 웨이퍼(1) 사이의 도금조 안에 위치하며, 웨이퍼(1)를 향해 빛을 투과하는 복수의 광원들(122)이 도금용액 안에서 밀봉된 상태에서 수평 행렬로 설치되어 광유도 도금(Light Induced Plating)을 실시하는 제 2 도금부(20); 및 도금용액을 교반하여 상기 기판 거치대(130)의 상부 분출구(133)를 통해 도금용액을 오버플로우 시키는 용액구동부(40);를 포함한다.