Sealing material for reaction chamber preparing semiconductor wafer and sealing material using the same

• Main Author: HWANG, EUI SIK
• Format: Patent
• Language: English; Korean
• Published: 24.03.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to a method for manufacturing a sealing member for a reaction chamber for manufacturing a semiconductor wafer and the sealing member using the same. The method for manufacturing the sealing member for the reaction chamber for manufacturing the semiconductor wafer and the sealing member using the same perform a complete sealing process in a semiconductor chamber by preventing a leakage in the semiconductor chamber. Also, the frequent replacement of the sealing member is reduced by improving the durability of the sealing member. Therefore, according to the present invention, the efficiency of the semiconductor wafer manufacturing process is improved and the failure rate of the manufactured product is reduced by solving problems in the semiconductor wafer manufacturing process.