PHOTOCURABLE COMPOSITION FOR PRODUCING PRINTED WIRING BOARD, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD

The present invention provides a photocurable composition for producing a printed wiring board, which has good adhesiveness, and the out gas generation from which is restrained, a cured product obtained by curing thereof and a printed wiring board. For such, provided is a photocurable composition fo...

Full description

Saved in:
Bibliographic Details
Main Authors KONDO SHINOBU, MATSUMOTO SHIGERU, NORIKOSHI AKIO
Format Patent
LanguageEnglish
Korean
Published 16.12.2014
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
Online AccessGet full text

Cover

More Information
Summary:The present invention provides a photocurable composition for producing a printed wiring board, which has good adhesiveness, and the out gas generation from which is restrained, a cured product obtained by curing thereof and a printed wiring board. For such, provided is a photocurable composition for producing a printed wiring board characterized by including at least one of photopolymerizable initiator represented by the following formulas (1) to (3). In addition, it is desirable that an organic binder be further included. (In the formula, n represents 0 or 1, R^1 to R^4 each independently represents a linear or branched alkyl group having 1 to 10 carbon atoms).
Bibliography:Application Number: KR20140077860