INTELLIGENT POWER MODULE WITH COMPACTION SIZE STANDARDIZED

• Main Authors: PARK, SUNG BUM, KWON, HYUK DONG, CHO, JEONG SU
• Format: Patent
• Language: English; Korean
• Published: 25.11.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention relates to an intelligent power module (IPM) which is standardized for miniaturization. The IPM includes: a power supply unit module which includes a heat dissipation member, multiple power elements mounted on the lower surface of the heat dissipation member, and a mold formed to surround the heat dissipation member and the power elements and is manufactured in the form of a transfer mold module; a signal unit module which is positioned in the lower side of the power supply unit module, includes a printed circuit board, multiple signal elements mounted on the printed circuit board, and a sealing member formed to surround the printed circuit board and the signal elements, and is manufactured in a BOC form; and a case which is built in by applying an electric current to the power supply unit module and the signal unit module, which are manufactured in a mutually separated way, by a lead frame. By exposing the heat dissipation member to the outside of the case, the present invention: enables the power supply unit module and the signal unit module to be designed respectively and easily; is able to respectively commercialize the power supply unit module and the signal unit module; is able to exchange only a corresponding part in case of a defect generation without a whole disposal like conventional ways; and enables a manufacturing work process for the power unit module and the signal unit module to become easy.