Method of correcting position of a die bonding head

• Main Authors: PARK, JOON SEOUN, MOON, SUN HONG
• Format: Patent
• Language: English; Korean
• Published: 16.10.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

With a position correcting method of a die bonding head, a first angle (θ1) formed of an X axis (X2 axis) path of the die bonding head against an X axis (X1 axis) of a camera and a second angle (θ2) formed of a Y axis (Y2 axis) path of the die bonding head against a Y axis (Y1 axis) of the camera are calculated by using a screen of the camera to confirm a die bonding position, actual distances between die bonding positions are obtained by dividing the distances into an X1 axis actual distance and a Y1 actual distance, a Y axis position correction amount at the time when the position of the die bonding head is being changed along the X2 axis as much as X1 axis actual distances and an X axis position correction amount at the time when the position of the die bonding head is being changed along the Y2 axis as much as Y1 axis actual distances are separately calculated by using the first and second angles and the X1 and Y1 axis actual distances, and after that the position of the die bonding head is corrected as much as the Y axis position correction amount and the X axis position correction amount so that the die bonding head bonds the die to the die bonding positions. Therefore, the die bonding head accurately bonds the die to a substrate.