METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK

• Main Authors: SEOK, DONG SOO, JANG, HYUK KYOO, KWON, HAE YONG, KIM, HYOUNG MIN
• Format: Patent
• Language: English; Korean
• Published: 19.05.2014
• Subjects: ARTIFICIAL STONE; BASIC ELECTRIC ELEMENTS; CEMENTS; CERAMICS; CHEMISTRY; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LIME, MAGNESIA; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; REFRACTORIES; SEMICONDUCTOR DEVICES; SLAG; TRANSPORTING; TREATMENT OF NATURAL STONE

The present invention relates to a method for manufacturing an electrostatic chuck and, more specifically, to a method for manufacturing an electrostatic chuck comprising a first step of arranging first and second aluminum nitride (AIN) substrates on which molybdenum contact terminals are inserted on the top surface at predetermined depths then are sintered, respectively; a second step of depositing conductive films on the top surface of the first and second AIN substrates to form film layers; a third step of photo-etching the film layers deposited on the top surface of the first and second AIN substrates to form electrode patterned layers; a fourth step of charging AIN powder on the top surface of the first and second AIN substrates, on which the electrode patterned layers are respectively formed, to be sintered on the first and second AIN substrates and attaching the first and second AIN substrates to each other by the sintering process of AIN powder; a fifth step of forming contact terminal holes by machining the holes from the bottom surface of the attached first and second AIN substrates to the bottom of the contact terminals; and a sixth step of inserting one among Mo and Kovar terminals in the machined contact terminal holes to be brazed on the bottom of the contact terminals. The present invention can reduce manufacturing costs with a simple manufacturing process because an electrostatic electrode and a heater electrode are integrated by attaching the AIN substrates while forming an electrostatic electrode pattern and a heater electrode pattern on the top surface of the basic material of the AIN substrates.