THIN FILM DEPOSITION APPARATUS

The present invention relates to a thin film deposition apparatus. According to the present invention, the thin film deposition apparatus includes: a chamber having a preset space; a substrate support part formed on the chamber to mount a substrate; and a gas supply part formed to relatively move to...

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Bibliographic Details
Main Author YOON, DAE GEUN
Format Patent
LanguageEnglish
Korean
Published 14.05.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a thin film deposition apparatus. According to the present invention, the thin film deposition apparatus includes: a chamber having a preset space; a substrate support part formed on the chamber to mount a substrate; and a gas supply part formed to relatively move to the substrate support part, supplies a process gas, and discharges a residual gas. The gas supply part comprises at least one supply channel which supplies the process gas and at least one discharge channel which discharges the residual gas. At least one among the supply channel is formed on the inner side of the discharge channel.
Bibliography:Application Number: KR20130018509