AN IMAGE SENSOR
An embodiment comprises; a photo-diode area formed on a first conductive semiconductor substrate; a second conductive first floating diffusion area which is separately formed on the first conductive semiconductor substrate with the photo-diode area; a second conductive second floating diffusion area...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
20.01.2014
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Subjects | |
Online Access | Get full text |
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Summary: | An embodiment comprises; a photo-diode area formed on a first conductive semiconductor substrate; a second conductive first floating diffusion area which is separately formed on the first conductive semiconductor substrate with the photo-diode area; a second conductive second floating diffusion area which is separately formed with the second conductive first floating diffusion area; a first gate formed on a semiconductor substrate between the photo-diode area and the second conductive first floating diffusion area; and a second gate formed on the first conductive semiconductor substrate between the second conductive first floating diffusion area and the second conductive second floating diffusion area. The size of a bonding area of the first conductive semiconductor substrate and the second conductive first floating diffusion area can be bigger than the size of a bonding area of the first conductive semiconductor substrate and the second conductive second floating diffusion area. |
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Bibliography: | Application Number: KR20120121945 |