POLYAMIDE RESIN COMPOSITION WITH EXCELLENT IMPACT RESISTANCE

PURPOSE: A polyamide resin composition is provided to elaborately mold the composition due to low shrinking ability, to perform a convenient molding by excellent workability, and to have transparent aesthetic appearance and excellent antibacterial property. CONSTITUTION: A polyamide resin compositio...

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Bibliographic Details
Main Authors JEON, KWAN SOO, KIM, TAK GYU, KWAK, HAN HO, CHAE, HONG WON
Format Patent
LanguageEnglish
Korean
Published 27.05.2013
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Summary:PURPOSE: A polyamide resin composition is provided to elaborately mold the composition due to low shrinking ability, to perform a convenient molding by excellent workability, and to have transparent aesthetic appearance and excellent antibacterial property. CONSTITUTION: A polyamide resin composition comprises: amorphous polyamide formed by condensation polymerization of octadecanoic acid and bis(3-methyl-4-aminocyclohexyl)methane; and 1-40 weight% of buffer based on the total weight of the composition. The buffer is selected from the group consisting of ethylene-butyl acrylate, ethylene propylene copolymer grafted with 5 weight% of glycidyl methacrylate copolymer and 0.5 weight% of maleic anhydride, ethylene octene copolymer grafted with 0.95 weigh% of maleic anhydride, and their mixture.
Bibliography:Application Number: KR20120124976