APPARATUS FOR PROCESS CHAMBER

• Main Authors: LEE, JONG HWA, KO, HYEOG JOON, YOON, SONG KEUN, LEE, JANG HYEOK
• Format: Patent
• Language: English; Korean
• Published: 22.01.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE: A process chamber is provided to improve the uniformity of a thin film by uniformizing the thin film completely processed in a chamber with uniform thermal distribution. CONSTITUTION: A plurality of substrates are separately laminated on a boat. A lower chamber housing(200) has a first inner space. An upper chamber housing(110) has a second inner space. The upper chamber housing is located on the upper layer of the lower chamber housing. A process gas spray unit includes a plurality of gas spray holes.