EPOXY RESIN COMPOUND HAVING EXCELLENT ELECTRICAL PROPERITIES

• Main Authors: LEE, JI AE, LEE, GUI HANG, PAEK, MI JEONG, HWANG, JAE SUK, HONH, SEONG HO, LEE, EUN YONG, LYU, YI YEOL, CHO, SANG PIL, PARK, YONG EUI, LEE, MIN JU, CHOI, HO KYOUNG
• Format: Patent
• Language: English; Korean
• Published: 17.01.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PURPOSE: An epoxy resin composition is provided to have high heat durability, high adhesion, low absorption and high splitting resistance and having excellent electric performance and low dielectric constant. CONSTITUTION: A dicyclopentadiene type epoxy resin composition comprises 100.0 parts by weight of a dicyclopentadiene type epoxy resin, and 0.5-50 parts by weight of a porous silica support of which the average particle diameter is 0.1-0.5 micron, the average pore size by nitrogen absorption analysis(BET) is 5 nm or less, and the specific surface area of nitrogen absorption analysis(BET) is 300 m^2/g or more, and additionally comprises 1-70 parts by weight of a hardener. The surface of the porous silica support is hydrophobically modified by accepting or spreading a hydrophobic functional group.