A BREAKING AND GRINDING APPARATUS FOR HTCC BOARD

• Main Authors: HONG, SEONG HOON, KIM, DEOK KUN
• Format: Patent
• Language: English; Korean
• Published: 21.12.2012
• Subjects: CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; FREQUENCY-CHANGING; GRINDING; HAND CUTTING TOOLS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PERFORMING OPERATIONS; PHYSICS; POLISHING; SEVERING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; TRANSPORTING

PURPOSE: An apparatus for high temperature co-fired ceramic substrates is provided to automatically cut and grind high temperature co-fired ceramic substrates as a plurality of breaking units and grinding units are installed on a transfer rail. CONSTITUTION: An automatic cutting and grinding apparatus for high temperature co-fired ceramic substrates comprises a first breaking unit and a side grinding unit. The first breaking unit comprises a base(310), an upper fixing part(320), a cutting prop(330), and a pressing part(340). A cut high temperature co-fired ceramic substrate is settled on the base. The upper fixing part is placed above the base, and a fixing cylinder(321) of the upper fixing part horizontally moves to fix the cut high temperature co-fired ceramic substrate. The cutting prop is placed on one side of the base, and a prop moving cylinder horizontally moves to fix the lower row of the cut high temperature co-fired ceramic substrate. The pressing part is placed at the upper part of the cutting prop, and cuts the substrate by pressing the high temperature co-fired ceramic substrate to be cut. The side grinding unit comprises first and second grinding parts. The first grinding unit grinds one surface of the high temperature co-fired ceramic substrate which is cut in a row. The second grinding unit grinds the other surface of the high temperature co-fired ceramic substrate which is cut in a row.