SEMICONDUCTOR PACKAGE FOR VERTICAL ADHESION

PURPOSE: A vertical mounting type semiconductor package is provided to make a semiconductor package structure to have a vertical mounting structure, thereby accurately detecting acceleration in x, y, z directions and angular speed. CONSTITUTION: A horizontal frame(12) is horizontally mounted on a te...

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Bibliographic Details
Main Authors KIM, JEONG TAE, KUO BOB SHIH WEI, GALLOWAY JESSE E, JANG, SUNG SIK, JUNG, JONG DAE
Format Patent
LanguageEnglish
Korean
Published 28.12.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A vertical mounting type semiconductor package is provided to make a semiconductor package structure to have a vertical mounting structure, thereby accurately detecting acceleration in x, y, z directions and angular speed. CONSTITUTION: A horizontal frame(12) is horizontally mounted on a test board. A semiconductor chip(30) is attached to a chip mounting section of the horizontal frame. A wire(32) connects the semiconductor chip with an inner lead(17) of the horizontal frame. A cap(40) is coupled with a horizontal molding unit(22). A bonding unit(34) bonds a vertical molding unit(24) with a side of the cap. The vertical molding unit is molded in a vertical frame(14).
Bibliography:Application Number: KR20100112355