A PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME

Disclosed herein is a method of manufacturing a printed circuit board, including the steps of providing a substrate including a first metal layer formed thereon, and forming a patterned first insulation layer on the first metal layer. The method further includes patterning the first metal layer to a...

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Bibliographic Details
Main Authors PARK, WON HYUNG, LIM, KYOUNG HWAN
Format Patent
LanguageEnglish
Korean
Published 22.09.2011
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Disclosed herein is a method of manufacturing a printed circuit board, including the steps of providing a substrate including a first metal layer formed thereon, and forming a patterned first insulation layer on the first metal layer. The method further includes patterning the first metal layer to allow the first metal layer to have a pattern corresponding to that of the first insulation layer, thus forming a first circuit layer, and forming a second insulation layer on the substrate such that the second insulation layer surrounds the first circuit layer and the first insulation layer formed on the first circuit layer. The printed circuit board is advantageous in that process time and process cost can be reduced because a first insulation layer is used as an etching resist and is included as a part of a printed circuit board even after etching.
Bibliography:Application Number: KR20100031995