DEPOSITING APPARATUS FOR FORMING THIN FILM

• Main Authors: SONG, KI CHUL, JUNG, SEUNG CHUL, AHN, WOO JUNG, CHO, WHANG SIN
• Format: Patent
• Language: English; Korean
• Published: 28.07.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE: A deposition apparatus for forming a thin film is provided to prevent congestion of an injection hole by preventing an attachment of raw materials or impurities from a raw material container to the injection hole. CONSTITUTION: A raw material container is formed to store raw materials of a solid state or a liquid state which are deposited on a substrate. A vaporization chamber is combined with the raw material container to vaporize the raw materials of the raw material container. An injection hole is formed at an upper part of the vaporization chamber to inject the vaporized raw materials to an upper side. A first heater is installed at an upper side of the raw materials within the raw material container.