WIRELESS COMMUNICATION MODULE

A miniaturized wireless communication module is provided to miniaturize the wireless communication module by supplying an electronic component miniaturized than the wireless communications module forming the electronic component inside a laminated substrate. A band pass filter(110) is formed inside...

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Bibliographic Details
Main Authors CHO, YUN HEE, PARK, YUN HWI
Format Patent
LanguageEnglish
Korean
Published 03.07.2009
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
TRANSMISSION
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Summary:A miniaturized wireless communication module is provided to miniaturize the wireless communication module by supplying an electronic component miniaturized than the wireless communications module forming the electronic component inside a laminated substrate. A band pass filter(110) is formed inside of a laminated substrate. A balloon circuit includes an unbalance device in which one end is connected to the band pass filter. First and second matching circuit(130) are connected to one end of each balance device of the balloon circuit. One is formed among the bandpass filter, the balloon circuit, and the first and the second matching circuit between the laminate dielectric sheet of the substrate by using the fixed number distributed elements.
Bibliography:Application Number: KR20080007189